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PMID: 11292767 Published · ppublish English Journal Article Research Support, Non-U.S. Gov't

Key role of teichoic acid net charge in Staphylococcus aureus colonization of artificial surfaces.

Infection and immunity ·Vol. 69 ·No. 5 ·2001-05-00 ·Pages 3423-6

Gross M, Cramton SE, Götz F, Peschel A

Abstract

Staphylococcus aureus is responsible for a large percentage of infections associated with implanted biomedical devices. The molecular basis of primary adhesion to artificial surfaces is not yet understood. Here, we demonstrate that teichoic acids, highly charged cell wall polymers, play a key role in the first step of biofilm formation. An S. aureus mutant bearing a stronger negative surface charge due to the lack of D-alanine esters in its teichoic acids can no longer colonize polystyrene or glass. The mutation abrogates primary adhesion to plastic while production of the glucosamine-based polymer involved in later steps of biofilm formation is not affected. Our data suggest that repulsive electrostatic forces can lead to reduced staphylococcal biofilm formation, which could have considerable impact on the design of novel implanted materials.

MeSH Terms
Alanine/physiology Bacterial Adhesion Bacterial Proteins/analysis Biofilms Polysaccharides, Bacterial/biosynthesis Staphylococcus aureus/physiology Static Electricity Teichoic Acids/chemistry,pharmacology
Chemicals
Bacterial Proteins Polysaccharides, Bacterial Teichoic Acids polysaccharide intercellular adhesin Alanine
Authors & Affiliations
4 authors, click to expand affiliations / ORCID
Gross M
Microbial Genetics, University of Tübingen, D-72076 Tübingen, Germany.
Cramton S E
Götz F
Peschel A
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Article Info
Journal
Infection and immunity
Abbr.
Infect Immun
ISSN
0019-9567
Published
2001-05-00
Pages
3423-6
Language
English
Region
United States
NLM ID
0246127
PMCID
PMC98303
Subset
IM
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